CMH08 2013-11-01 1 toshiba high efficiency rectif ier silicon epitaxial type CMH08 switching mode power supply applications ? repetitive peak reverse voltage: v rrm = 400 v ? average forward current: i f (av) = 2.0 a ? low forward voltage: v fm =1.3 v(max.) ? very fast reverse recovery time: trr =50ns(max.) ? suitable for compact assembly due to small surface-mount package ?m ? flat tm ? (toshiba package name) absolute maximum ratings (ta = 25c) characteristics symbol rating unit repetitive peak reverse voltage v rrm 400 v average forward current i f (av) 2.0 (note 1) a peak one cycle surge forward current (non-repetitive) i fsm 30 (50 hz) a junction temperature t j ?40~150 c storage temperature range t stg ?40~150 c note 1: t ? 110c device mounted on a ceramic board board size: 50 mm 50 mm soldering land: 2 mm 2 mm board thickness:0.64t note 2: using continuously under h eavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/v oltage, etc.) are within the absolute maximum ratings. please design the appropriate reliability upon reviewing the toshiba semiconductor reliability handbook (?handling precautions?/derating concept and methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). electrical characteristics (ta = 25c) characteristics symbol test condition min typ. max unit v fm (1) i fm = 0.1 a (pulse test) ? 0.77 ? v fm (2) i fm = 1.0 a (pulse test) ? 0.98 ? peak forward voltage v fm (3) i fm = 2.0 a (pulse test) ? 1.1 1.3 v peak repetitive reverse current i rrm v rrm = 400 v (pulse test) ? ? 10 a reverse recovery time t rr i f = 1 a, di/dt = ? 30 a/ s ? ? 50 ns forward recovery time t fr i f = 1.0 a ? ? 100 ns device mounted on a ceramic board (board size: 50 mm 50 mm) (soldering land: 2 mm 2 mm) (board thickness: 0.64 t) ? ? 60 device mounted on a glass-epoxy board (board size: 50 mm 50 mm) (soldering land: 6 mm 6 mm) (board thickness: 1.6 t) ? ? 135 thermal resistance (junction to ambient) r th (j-a) device mounted on a glass-epoxy board (board size: 50 mm 50 mm) (soldering land: 2.1 mm 1.4 mm) (board thickness: 1.6 t) ? ? 210 c/w thermal resistance (junction to lead) r th (j- ? ) ? ? ? 16 c/w unit: mm jedec D jeita D toshiba 3-4e1a weight: 0.023 g (typ.) start of commercial production 2002-12
CMH08 2013-11-01 2 marking abbreviation code part no. h8 CMH08 standard soldering pad handling precaution the absolute maximum ratings denote the absolute maximum ratings, which are rated values and must not be exceeded during operation, even for an instant. the following are the general derating methods that we recommend when you design a circuit with a device. vrrm: we recommend that the worst case voltage, includi ng surge voltage, be no greater than 80% of the absolute maximum rating of vrrm for a dc circuit and be no gr eater than 50% of that of vrrm for an ac circuit. vrrm has a temperature coefficient of 0.1%/ . take this temperature coefficient into account designing a device at low temperature. if(av): we recommend that the worst case current be no gr eater than 80% of the absolut e maximum rating of if(av). carry out adequate heat design. if you can?t design a circuit with excellent heat radiation, set the margin by using an allowable tamax-if (av) curve. this rating specifies the non-repetitive peak current in one cycle of a 50-hz si ne wave, condition angle 180. therefore, this is only applied for an abnormal operation, whic h seldom occurs during t he lifespan of the device. we recommend that a device be used at a tj of below 120 under the worst load and heat radiation conditions. thermal resistance between junction and ambient fluctuates depending on the device?s mounting condition. when using a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value. please refer to the rectifiers da tabook for further information. 3.0 1.4 2.1 unit: mm 1.4
CMH08 2013-11-01 3 average forward current i f (av) (a) t ? max ? i f (av) maximum allowable lead temperature t ? max (c) average forward current i f (av) (a) p f (av) ? i f (av) average forward power dissipation p f (av) (w) 0 0 0.4 1.0 0.2 0.4 0.6 0.8 1.0 2.2 0.2 0.6 0.8 160 60 0 20 40 80 100 120 140 instantaneous forward voltage v f (v) i f ? v f instantaneous forward current i f (a) 0.4 0.01 1 100 0.8 1.2 1.6 2.0 150c t j = 25c 75c 0.1 10 1.2 1.4 1.2 1.4 2.2 0.2 0 0.4 0.6 1.0 0.8 1.2 1.4 2.2 pulse test average forward current i f (av) (a) ta m a x ? i f (av) maximum allowable ambient temperature ta m a x ( c ) 160 60 0 20 40 80 100 120 140 1000 1 100 10 0.001 1000 0.01 0.1 100 10 1 3 5 30 50 300 500 0.003 0.03 0.3 3 30 300 transient thermal impedance r th (j-a) (c/w) time t (s) r th (j-a) ? t 2.4 2.0 1.6 1.6 1.8 1.8 2.0 1.6 1.8 2.0 0.2 0 0.4 0.6 1.0 0.8 1.2 1.4 2.2 1.6 1.8 2.0 360 0 180 rectangular waveform 360 0 180 rectangular waveform 360 0 180 rectangular waveform device mounted on a glass-epoxy board: board size: 50 mm 50 mm soldering land: 6.0 mm 6.0 mm board thickness: 1.6 t device mounted on a glass-epoxy board: board size: 50 mm 50 mm soldering land: 2.1 mm 1.4 mm board thickness: 1.6 t device mounted on a glass-epoxy board: board size: 50 mm 50 mm soldering land: 6.0 mm 6.0 mm board thickness: 1.6 t device mounted on a ceramic board: board size: 50 mm 50 mm soldering land: 2.0 mm 2.0 mm board thickness: 0.64 t
CMH08 2013-11-01 4 1 100 10 0 20 40 50 10 30 ta = 25c f = 50 hz number of cycles surge forward current (non-repetitive) peak surge forward current i fsm (a) junction capacitance c j (pf) reverse voltage v r (v) c j ? v r (typ.) 1 1 5 10 100 10 3 50 30 100 ta = 25c f = 1 mhz
CMH08 2013-11-01 5 restrictions on product use ? toshiba corporation, and its subsidiaries and affiliates (collect ively "toshiba"), reserve the right to make changes to the in formation in this document, and related hardware, software and systems (collectively "product") without notice. ? this document and any information herein may not be reproduc ed without prior written permission from toshiba. even with toshiba's written permission, reproduc tion is permissible only if reproduction is without alteration/omission. ? though toshiba works continually to improve product's quality and reliability, product can malfunction or fail. customers are responsible for complying with safety standards and for prov iding adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a ma lfunction or failure of product could cause loss of human life, b odily injury or damage to property, including data loss or corruption. before customers use the product, create designs including the product, or incorporate the product into their own applications, cu stomers must also refer to and comply with (a) the latest versions of all relevant toshiba information, including without limitation, this document, the specifications, the data sheets and application notes for product and the precautions and condi tions set forth in the "toshiba semiconductor reliability handbook" and (b) the instructions for the application with which the product will be us ed with or for. customers are solely responsible for all aspe cts of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this product in such design or applications; (b) eval uating and determining the applicability of any info rmation contained in this document, or in c harts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operatin g parameters for such designs and applications. toshiba assumes no liability for customers' product design or applications. ? product is neither intended nor warranted fo r use in equipments or systems that require extraordinarily high levels of quality and/or reliability, and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage and/or serious public impact ( " unintended use " ). except for specific appl ications as expressly stated in this document, unintended use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used f or automobiles, trains, ships and other transportation, traffic si gnaling equipment, equipment used to control combustions or expl osions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. if you use product for unintended use, toshiba assumes no liability for product. for details, please contact your toshiba sales representative. ? do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy product, whether in whole or in part. ? product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. ? the information contained herein is pres ented only as guidance for product use. no re sponsibility is assumed by toshiba for an y infringement of patents or any other intellectual property rights of third parties that may result from the use of product. no license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. ? absent a written signed agreement, except as provid ed in the relevant terms and conditions of sale for product, and to the maximum extent allowable by law, toshiba (1) assumes no liability wh atsoever, including without limitation, indirect, co nsequential, special, or incidental damages or loss, including without limitation, loss of profit s, loss of opportunities, business interruption and loss of data, and (2) disclaims any and all express or implied warranties and conditions related to sale, use of product, or information, including warranties or conditions of merchantability, fitness for a particular purpose, accuracy of information, or noninfringement. ? do not use or otherwise make available product or related so ftware or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or m anufacturing of nuclear, chemical , or biological weapons or missi le technology products (mass destruction w eapons). product and related software and technology may be controlled under the applicable export laws and regulations including, without limitat ion, the japanese foreign exchange and foreign trade law and t he u.s. export administration regulations. export and re-export of pr oduct or related software or technology are strictly prohibit ed except in compliance with all appl icable export laws and regulations. ? please contact your toshiba sales representative for details as to environmental matters such as the rohs compatibility of pro duct. please use product in compliance with all applicable laws and regula tions that regulate the inclusion or use of controlled subs tances, including without limitation, the eu rohs directive. toshiba assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations.
|
